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Graphic line
| type | Processing capacity | illustrate |
| The highest number of floors | 16 | Batch processing capacity 1-12 layers, sample processing capacity 1-16 layers |
| surface treatment | Carbon oil, spray tin, lead-free spray tin, immersion gold, immersion silver, OSP, gold finger, HAL | |
| Plate thickness range | ±10% | For example, the plate thickness T=1.6mm, the actual plate thickness is 1.44mm (T-1.6×10%)~1.76mm (T+1.6×10%) |
| Plate thickness tolerance T≥1.0mm | ±0.1mm | For example, the thickness of the plate is T=0.8mm, and the thickness of the actual plate is 0.7mm(T-0.1)~0.9mm(T+0.1) |
| Plate type | FR-4, CEM-1, 94-V0, aluminum base, FR4 board use Kingboard Grade A material on both sides |
Drilling
| type | Processing capacity | illustrate |
| Half-hole process minimum half-hole diameter | 0.5mm | The half-hole process is a special process, and the minimum hole diameter must not be less than 0.5mm |
| Minimum aperture | 0.1mm | The minimum diameter of mechanical drilling is 0.2mm, and the minimum diameter of laser drilling is 0.1MM. The recommended design is 0.3mm or more when conditions allow, and the tolerance of the diameter is ±0.075mm. |
| Minimum slot diameter | 0.6mm | Slot hole diameter tolerance is ±0.1mm |
| Minimum hole spacing for mechanical drilling | ≥0.2mm | The minimum hole distance of mechanical drilling needs to be ≥0.2mm, and the hole distance of different networks is ≥0.25mm |
| Stamp Hole Diameter | 0.5mm | The stamp hole spacing is 0.25mm, and it is added in the middle of the outer frame. The minimum number of stamp holes should be ≥3 |
| Plug hole diameter | ≤0.6mm | Over 0.6mm via surface pad cover oil |
| Through hole unilateral solder ring | 4mil | Via minimum 4mil, device hole minimum 6mil, enlarging the via solder ring is helpful for overcurrent |
Character
| type | Processing capacity | illustrate |
| Minimum character width | ≥0.6mm | The minimum width of the characters, if it is less than 0.6mm, the actual board may cause the characters to be unclear due to design reasons |
| Minimum character height | ≥0.8mm | The minimum height of the characters, if it is less than 0.8mm, the actual board may cause the characters to be unclear due to design reasons |
| Minimum character line width | ≥5mil | The minimum line width of characters, if it is less than 5mil, the actual board may cause poor character silk screen due to design reasons |
| SMD character frame distance Solder mask spacing | ≥0.2mm | If the distance between the SMD character frame and the solder mask is less than 0.2mm, when the characters are removed after the solder mask is opened, the line width of the character frame will be insufficient, resulting in poor silk screen printing. |
| character aspect ratio | 1:6 | The most suitable aspect ratio is more conducive to production |
Craft
| type | Processing capacity | illustrate |
| Peel strength | ≥2.0N/cm | |
| flame retardancy | 94V-0 | |
| Impedance type | Single-ended, differential, coplanar (single-ended, differential) | Single-ended or coplanar single-ended impedance can be controlled: 45~85 ohms, differential or coplanar differential impedance can be controlled: 85~110 ohms |
| Special Process | Resin plug hole, hole in plate, mixed plate, PTFE, blind buried hole, bonded IC (special process needs process review before going offline) |
Solder mask
| type | Processing capacity | illustrate |
| Solder mask type | Photosensitive ink | The half-hole process is a special process, and the minimum hole diameter must not be less than 0.5mm |
| Solder mask bridge |
Green oil≥0.1mm Variegated oil≥0.12mm Black and white oil≥0.15mm |
Making a solder mask bridge requires the design spacing of the circuit pads to be 0.18 or more. The thicker the copper thickness, the larger the spacing. Special devices (such as triodes) are allowed to be slightly soldered on the circuit PAD or printed with white oil blocks. |
Pcb process shape
| type | Processing capacity | illustrate |
| Minimum Grooving Knife | 0.60mm | The minimum width of copper slot in the board is 0.60mm, and the width of no copper slot is 0.6 |
| biggest size | 01200mm x 600mm | Zhonglei PCB supports a maximum length of 1200MM and a maximum size of 700*700mm. Please contact customer service for special circumstances. |
| V-CUT |
V-CUT direction length≥80mm V-CUT trend width≤380mm |
1. The length of the V-CUT line refers to the length from the end point of the V-CUT line to the end point 2. The width of the V-CUT direction refers to the width of the board perpendicular to the V-CUT direction |
Number of layers
| type | Processing capacity | illustrate |
| The highest number of floors | 16 | Batch processing capacity 1-12 layers, sample processing capacity 1-16 layers |
| surface treatment | Carbon oil, spray tin, lead-free spray tin, immersion gold, immersion silver, OSP, gold finger, HAL | |
| Plate thickness range | 0.4-4.0mm | Conventional plate thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0 mm; the thickest plate thickness can be processed to 3.5 in large quantities |
| Plate thickness tolerance T≥1.0mm | ±10% | For example, the plate thickness T=1.6mm, the actual plate thickness is 1.44mm (T-1.6×10%)~1.76mm (T+1.6×10%) |
| Plate Thickness Tolerance T<1.0mm | ±0.1mm | For example, the thickness of the plate is T=0.8mm, and the thickness of the actual plate is 0.7mm(T-0.1)~0.9mm(T+0.1) |
| Plate type | FR-4, CEM-1, 94-V0, aluminum base, FR4 board use Kingboard Grade A material on both sides |
Design software
| type | Processing capacity | illustrate |
| Pads software |
Hatch method of copper plating Minimum fill pad ≥ 0.0254mm |
The manufacturer uses reduction copper, customers who use pads for this design must pay attention When customers design the smallest custom pad, pay attention to the minimum D code size of the filling can not be less than 0.0254mm |
| Protel 99se software |
Special D code off-board objects |
A small number of engineers use special D codes when designing, and D codes are easily replaced or lost during data conversion, resulting in data problems The design engineer mistakenly placed the components far away from the PCB board, and the conversion process could not be output due to the too large size boundary |
| Altium Designer software |
Version issues font problem |
Altium Designer software has many version series, and the compatibility is poor. The design file should indicate the software version number used When design engineers design special fonts, they are easily replaced by other fonts during the file conversion process. |
| Window layer in Protel/dxp software | Solder layer | A few engineers mistakenly put it on the paste layer, Zhonglei PCB does not deal with the paste layer |
